Wafer edge inspection device "EdgeScan G6"
Wafer edge inspection device utilizing laser application technology and sensor/image processing technology.
The "EdgeScan G6" is a wafer edge inspection device that incorporates new mechanisms compatible with the BSI-CIS process and TSV process, which were not available in previous models. It covers all shape and dimension measurements and defect inspections in the edge vicinity area related to processes such as wafer bonding, trimming, and thinning. Utilizing unique laser application technology along with sensor and image processing technology, it strongly supports the stabilization of device processes. 【Features】 ■ Backside suction transport and measurement ■ Laser and line sensor image measurement ■ Metric Based Binning (ADC function) ■ Color review function ■ Multi-layer film boundary measurement using phase camera *For more details, please refer to the catalog or feel free to contact us.
- Company：オプティマ https://www.optima-1.co.jp/
- Price：Other
